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ASTM F 3192 : 2016
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ASTM F 3192 : 2016 Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)
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CONTAINED IN VOL. 10.04, 2016 Specifies the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.
R00001258
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ASTM F 3192 : 2016 Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)