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ASTM F 3166 : 2016
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ASTM F 3166 : 2016 Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023)
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CONTAINED IN VOL. 10.04, 2016 Specifies the generic criteria requirements of high pure titanium sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advance packaging.
R00001270
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ASTM F 3166 : 2016 Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023)